Burn-In Test
The Burn-In Test is a semiconductor reliability testing method where test devices are loaded onto a Burn-In Board (BIB), a product designed to match the specific characteristics of each device. These boards are placed in a chamber where a constant temperature of over 125°C is maintained, and voltage and signals are applied to screen for early device failures and evaluate device reliability (life-time).
PCB Design
BIBs are configured with multiple sockets and electrical circuits to accommodate various electronic components.
Stress Testing
By repeatedly exposing devices to high currents, voltages, or thermal stress over extended periods, the test verifies whether the components function normally or develop defects after a certain period.
Test Environment
Devices are tested in a Burn-In Oven under controlled conditions to monitor performance degradation or defect occurrence.
Early Failure Detection
Identifies initial failures, preventing defective devices from reaching end-users.
Quality Control
Verifies manufacturing process quality and ensures
that produced components meet consistent quality standards.
Ensuring Product Reliability
Components that undergo the Burn-In process demonstrate increased reliability during long-term use.
This is especially critical in industries requiring high reliability, such as aerospace, automotive, and medical equipment.
Burn-In Board Service
Edge Damage & Other Issues