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PMI(Probe Mark Inspection) KWI-300

PMI Inspection System Overview (Probe Mark Inspection)

This equipment inspects the size and location of Probe Marks on Wafer PADs to evaluate the contact characteristics of the Probe Card. Unlike conventional sample inspection or visual inspection, it can inspect all PADs on a wafer in a short time, identifying the pattern and behavior of contact marks. Furthermore, by analyzing PMI Data, it helps improve the quality of the Probe Card. By analyzing the length of Contact Scrub Marks, it is possible to check for needle tip breakage after testing. Inspection results can be exported as CSV files and submitted to the customer as reports.

PMI(Probe Mark Inspection) 장비사양

ItemSpecification
Machine NameWI-300 (*Formerly KI-300)
Measurement Time (12inch / 10,000 Pins)≤15 minutes (Used Mid)
*Time may vary depending on PAD shape/location
Measurement MethodArea Confocal
PrecisionPixel Size: 1 μm, Resolution: ≤1 μm
LightingStandard
High-Speed FocusStandard
Tool-to-tool CorrelationStandard
On-the-fly Image CaptureStandard (Mono)
Full Wafer Color Image CaptureStandard (Color)
Turret AssemblyLinear turret (4-position)

  1. Supports 8-inch and 12-inch wafers
  2. Enables post-analysis of PMI data even after test completion and retesting of failed data
  3. User-friendly operation, PMI result data generation supported
  4. Enables post-analysis of PMI data even after test completion and retesting of failed data
  5. PMI inspection possible for blank wafers
  6. Customer-customized options available (1port/2port LPM, FFU, Wafer Surface Inspection Vision Module, etc.)
  7. Supports a variety of lens combinations (1X*, 2X, 5X, 10X, 20X)
  8. Data backup supported (Hard Disk Mirroring)
  9. Capable of automatic movement to pre-defined PAD positions


Objective Lenses & Field of View (FOV):

Magnification1X (Option)2X5X10X20X
FOV (mm)8.0 × 6.04.0 × 3.01.6 × 1.20.8 × 0.60.4 × 0.3

Equipment Setup Types

Device Setting [Type 1] Wafer Map provided through Live Vision Test / Untested Die settings PAD Data generation 📌 [Create Wafer Map]Device Setting [Type 2] Probe Card Data loading No Wafer Map or PAD Data generation 📌 [Create Wafer Map from Card Data]

This explanation compares two types of device setting methods (Type 1 and Type 2). Type 1 involves manually creating a wafer map and collecting pad information, while Type 2 automatically generates the wafer map based on the data stored in the probe card.

Retest Function

Online retesting is available for all failed results or selected PADs. Retesting can be performed by comparing previous inspection results with the actual wafer.

DATA 시트 / Retest 기능

PMI 결과 데이터 (20종) 출력 및 요약
Fail 결과 전체 또는 선택된 Pad에 대한 Online Retest 가능
기존 결과 Data들을 불러오고, 실제 Wafer와 비교 및 Retest 가

확대 배율

PAD 위치 및 형상에 따른 PMI 시간

  • Wafer Size : 12inch Wafer
  • Probe Card Type : Memory Probe Card